US 12,115,767 B2
Pad removal method and device
Chunhung Chen, Hsinchu (TW); and Sheng-Chen Wang, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Jan. 9, 2023, as Appl. No. 18/151,943.
Application 18/151,943 is a continuation of application No. 17/229,311, filed on Apr. 13, 2021, granted, now 11,554,578.
Application 17/229,311 is a continuation of application No. 16/392,809, filed on Apr. 24, 2019, granted, now 10,987,913, issued on Apr. 27, 2021.
Application 16/392,809 is a continuation of application No. 15/488,958, filed on Apr. 17, 2017, granted, now 10,272,661, issued on Apr. 30, 2019.
Prior Publication US 2023/0158791 A1, May 25, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 43/00 (2006.01); B24B 37/34 (2012.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01)
CPC B32B 43/006 (2013.01) [B24B 37/34 (2013.01); B32B 7/12 (2013.01); B32B 37/12 (2013.01); B32B 2307/538 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1978 (2015.01); Y10T 156/1989 (2015.01)] 18 Claims
OG exemplary drawing
 
1. A pad removal method comprising:
affixing a first end of a pad guide to a first location of a pad;
affixing a second end of the pad guide to a second location of the pad; and
moving the first end from a first position, a first distance from the second location, to a second position, a second distance from the second location, wherein the first distance is greater than a width of the pad, and the second distance is less than the width of the pad.