US 12,115,736 B2
Bonding tool, bonding device and bonding method
Rudolf Kaiser, Lappersdorf (DE); and Horst Lapsien, Regensburg (DE)
Assigned to ASMPT AMICRA MICROTECHNOLOGIES GMBH, Regensberg (DE)
Appl. No. 17/597,912
Filed by ASM AMICRA Microtechnologies GmbH, Regensburg (DE)
PCT Filed Jul. 29, 2020, PCT No. PCT/EP2020/071362
§ 371(c)(1), (2) Date Jan. 28, 2022,
PCT Pub. No. WO2021/023591, PCT Pub. Date Feb. 11, 2021.
Claims priority of application No. 10 2019 120 955.2 (DE), filed on Aug. 2, 2019.
Prior Publication US 2022/0274347 A1, Sep. 1, 2022
Int. Cl. B29C 65/48 (2006.01); B29C 65/52 (2006.01); B29C 65/78 (2006.01)
CPC B29C 65/4845 (2013.01) [B29C 65/524 (2013.01); B29C 65/782 (2013.01); B29C 65/7847 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A bonding tool for a bonding device for bonding at least one component by adhesives to a substrate, the bonding tool comprising:
a circular disk-shaped base body lying in a base plane and having an opening and a receiving head connected to the circular disk-shaped base body for receiving and holding the at least one component, wherein an orthogonal projection of the receiving head onto the base plane lies within the opening, so that the receiving head can be accessed freely through the opening, wherein the bonding tool comprises a lighting unit, which is integrated in the bonding tool, for curing the adhesives.