US 12,115,706 B2
Molded article, electrical product and method for producing molded article
Chuzo Taniguchi, Kyoto (JP); Ryomei Omote, Kyoto (JP); Eiji Kawashima, Kyoto (JP); Junichi Shibata, Kyoto (JP); Jun Sasaki, Kyoto (JP); and Yoshihiro Sakata, Kyoto (JP)
Assigned to NISSHA CO., LTD., Kyoto (JP)
Appl. No. 17/796,739
Filed by NISSHA CO., LTD., Kyoto (JP)
PCT Filed Jan. 22, 2021, PCT No. PCT/JP2021/002273
§ 371(c)(1), (2) Date Aug. 1, 2022,
PCT Pub. No. WO2021/157391, PCT Pub. Date Aug. 12, 2021.
Claims priority of application No. 2020-018729 (JP), filed on Feb. 6, 2020.
Prior Publication US 2023/0075178 A1, Mar. 9, 2023
Int. Cl. B29C 45/14 (2006.01); B29C 33/14 (2006.01); B29C 45/26 (2006.01); H05K 5/00 (2006.01)
CPC B29C 45/14467 (2013.01) [B29C 33/14 (2013.01); B29C 45/26 (2013.01); H05K 5/00 (2013.01); B29C 2045/14122 (2013.01); B29C 2045/14139 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A molded article, comprising:
a circuit film that includes a thermoplastic insulating film and an electrical circuit formed on the insulating film; and
a molded body having a first main surface and a second main surface opposed to the first main surface, the molded body being integrally molded with the circuit film located on the first main surface, wherein
the circuit film includes a flexible wiring portion in which a wiring line connected to the electrical circuit is formed,
the molded body has a through-hole that penetrates from the first main surface to the second main surface, and
in the flexible wiring portion, a first flexible wiring portion surface is arranged so as to run along a wall surface of the through-hole and a second flexible wiring portion surface is arranged such that a clearance is formed between the second flexible wiring portion surface and the wall surface of the through-hole, and a connection terminal is arranged in the through-hole or at a position of passing through the through-hole and beyond the second main surface.