US 12,115,602 B2
Lead-free solder compositions
Ranjit Pandher, Waterbury, CT (US); Niveditha Nagarajan, Waterbury, CT (US); Anil Kumar, Waterbury, CT (US); Morgana de Avila Ribas, Waterbury, CT (US); Gyan Dutt, Waterbury, CT (US); Siuli Sarkar, Waterbury, CT (US); and Carl Bilgrien, Waterbury, CT (US)
Assigned to Alpha Assembly Solutions Inc., Waterbury, CT (US)
Appl. No. 17/309,818
Filed by ALPHA ASSEMBLY SOLUTIONS INC., Somerset, NJ (US)
PCT Filed Dec. 26, 2019, PCT No. PCT/EP2019/025490
§ 371(c)(1), (2) Date Jun. 21, 2021,
PCT Pub. No. WO2020/135932, PCT Pub. Date Jul. 2, 2020.
Claims priority of provisional application 62/788,169, filed on Jan. 4, 2019.
Claims priority of provisional application 62/785,293, filed on Dec. 27, 2018.
Prior Publication US 2022/0072664 A1, Mar. 10, 2022
Int. Cl. B23K 35/00 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01)
CPC B23K 35/262 (2013.01) [C22C 13/00 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A lead-free solder alloy consisting essentially of:
from 1 to 3.5 wt. % copper,
from 0.001 to 0.05 wt. % nickel,
from 0.0005 to 0.08 wt. % germanium,
the balance tin together with any unavoidable impurities.