US D1,098,220 S
Mainframe of dual-robot substrate processing system
Michael R. Rice, Pleasanton, CA (US); Michael C. Kuchar, Georgetown, TX (US); Travis Morey, Austin, TX (US); Adam J. Wyatt, Round Rock, TX (US); and Ofer Amir, Half Moon Bay, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on May 16, 2024, as Appl. No. 29/942,613.
Application 29/942,613 is a division of application No. 29/830,396, filed on Mar. 11, 2022, granted, now D1029066.
Term of patent 15 Years
LOC (15) Cl. 15 - 09
U.S. Cl. D15—141  [D15/138]
OG exemplary drawing
 
The ornamental design for a mainframe of dual-robot substrate processing system, as shown and described.