Seungwon Im, Seoul (KR); Jeonghyuk Park, Incheon (KR); Keunhyuk Lee, Suzhou (CN); Jerome Teysseyre, Scottsdale, AZ (US); and Paolo Bilardo, Munich (DE)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Dec. 2, 2022, as Appl. No. 29/861,844.
Term of patent 15 Years
LOC (15) Cl. 13 - 03
U.S. Cl. D13—182
The ornamental design for a power module package, as shown and described.
