US D1,097,802 S
Package
Nafei Chen, Hangzhou (CN); Hua Tian, Hangzhou (CN); and Tianhao Li, Hangzhou (CN)
Assigned to LEADWAY (HK) LIMITED, Hong Kong (CN)
Filed by LEADWAY (HK) LIMITED, Hong Kong (CN)
Filed on Sep. 8, 2022, as Appl. No. 29/852,539.
Claims priority of application No. 202230125758.3 (CN), filed on Mar. 11, 2022.
Term of patent 15 Years
LOC (15) Cl. 09 - 05
U.S. Cl. D 9—713
OG exemplary drawing
 
The ornamental design for a package as shown and described.