| CPC H10K 59/873 (2023.02) [H10K 59/124 (2023.02); H10K 59/8731 (2023.02); H10K 50/17 (2023.02); H10K 50/171 (2023.02); H10K 59/131 (2023.02); H10K 59/65 (2023.02)] | 18 Claims |
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1. A display device comprising:
a resin substrate layer;
a thin film transistor layer provided on the resin substrate layer and including an underlying inorganic insulation film, an underlying wiring layer, and an organic insulation film, all of which are stacked in a stated order;
a light-emitting element layer provided on the thin film transistor layer and including a plurality of first electrodes, a common functional layer, and a second electrode that is common, all of which are stacked in a stated order, correspondingly to a plurality of subpixels included in a display area;
a sealing film provided so as to cover the light-emitting element layer and including a first inorganic sealing film, an organic sealing film, and a second inorganic sealing film, all of which are stacked in a stated order;
an outer damming wall provided in a frame area around the display area so as to surround the display area and overlapping an outer peripheral portion of the organic sealing film; and
an inner damming wall provided in a non-display area so as to surround a plurality of inner protrusions and overlapping an inner peripheral end portion of the organic sealing film, wherein
the non-display area that is insular is provided inside the display area,
a through hole extending through the resin substrate layer in a direction of a thickness of the resin substrate layer is provided in the non-display area,
the plurality of inner protrusions is provided in the non-display area so as to surround the through hole,
each of the plurality of inner protrusions includes:
an underlying resin layer including the resin substrate layer, and
an underlying inorganic insulation layer provided on the underlying resin layer and made of a same material and in a same layer as the underlying inorganic insulation film,
the underlying resin layer in each of the plurality of inner protrusions is separated by a plurality of inner slits formed on a surface on an underlying inorganic insulation film side of the resin substrate layer so as to surround the through hole,
the underlying inorganic insulation layer is provided so as to project like an eave from the underlying resin layer to either one or both of a through hole side and a display area side,
one of the plurality of inner slits that is closest to an inner damming wall side includes an eave portion in which the underlying inorganic insulation film projects from the display area side to the through hole side,
an outer protrusion is annularly provided on a display area side of the inner damming wall in the non-display area so as to surround the inner damming wall,
the outer protrusion includes an overlying resin layer made of a same material and in a same layer as the organic insulation film,
the overlying resin layer is in contact with the organic sealing film via the first inorganic sealing film,
the thin film transistor layer further includes a first overlying inorganic insulation film provided on an upper layer side of the organic insulation film,
the outer protrusion further includes an overlying inorganic insulation layer provided on the overlying resin layer and made of a same material and in a same layer as the first overlying inorganic insulation film, and
the overlying inorganic insulation layer is provided so as to project like an eave from the overlying resin layer to either one or both of the inner damming wall side and the display area side.
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