US 12,446,435 B2
Method of manufacturing a display apparatus
Donghyeon Jang, Yongin-si (KR); Wonse Lee, Yongin-si (KR); Sukyoung Kim, Yongin-si (KR); Youngsoo Yoon, Yongin-si (KR); Yunkyeong In, Yongin-si (KR); Yujin Jeon, Yongin-si (KR); and Hyunji Cha, Yongin-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Jun. 27, 2023, as Appl. No. 18/342,091.
Application 18/342,091 is a division of application No. 17/032,326, filed on Sep. 25, 2020, granted, now 11,730,025.
Claims priority of application No. 10-2019-0119830 (KR), filed on Sep. 27, 2019.
Prior Publication US 2023/0337495 A1, Oct. 19, 2023
Int. Cl. H10K 59/40 (2023.01); H10K 19/20 (2023.01); H10K 59/121 (2023.01); H10K 59/123 (2023.01); H10K 59/124 (2023.01); H10K 59/131 (2023.01); H10K 59/60 (2023.01); H10K 59/80 (2023.01); H10K 77/10 (2023.01)
CPC H10K 59/40 (2023.02) [H10K 59/123 (2023.02); H10K 59/124 (2023.02); H10K 59/60 (2023.02); H10K 19/20 (2023.02); H10K 59/121 (2023.02); H10K 59/131 (2023.02); H10K 59/8722 (2023.02); H10K 59/8723 (2023.02); H10K 59/873 (2023.02); H10K 77/10 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a display apparatus, the method comprising:
forming a buffer layer on a substrate;
forming a first hole penetrating the buffer layer and exposing a portion of the substrate;
forming a display layer on the buffer layer, the display layer comprising display elements and bypass lines;
forming a second hole penetrating the display layer, wherein the second hole is connected to the first hole and concentric thereto; and
forming an encapsulation member to cover the display layer,
wherein at least a portion of an upper surface of the buffer layer is exposed by the second hole, and
wherein the first hole is formed after the second hole is formed.