US 12,446,412 B2
Display device and production method thereof
Mayuko Sakamoto, Sakai (JP)
Assigned to SHARP KABUSHIKI KAISHA, Sakai (JP)
Appl. No. 17/280,131
Filed by SHARP KABUSHIKI KAISHA, Osaka (JP)
PCT Filed Sep. 28, 2018, PCT No. PCT/JP2018/036285
§ 371(c)(1), (2) Date Mar. 25, 2021,
PCT Pub. No. WO2020/065922, PCT Pub. Date Apr. 2, 2020.
Prior Publication US 2022/0006049 A1, Jan. 6, 2022
Int. Cl. H10K 59/124 (2023.01); H10K 50/84 (2023.01); H10K 50/844 (2023.01); H10K 59/131 (2023.01); H10K 59/80 (2023.01)
CPC H10K 59/124 (2023.02) [H10K 50/844 (2023.02); H10K 50/846 (2023.02); H10K 59/131 (2023.02); H10K 59/873 (2023.02)] 11 Claims
OG exemplary drawing
 
1. A display device, comprising:
a resin substrate;
a TFT (thin film transistor) layer provided on the resin substrate and including a plurality of an inorganic insulating films layered on the resin substrate;
a light-emitting element configuring a display region provided on the TFT layer;
a frame region provided around the display region; and
a terminal portion provided at a left end portion of the frame region and arrayed with a plurality of terminals,
wherein the frame region is provided with a plurality of lead wiring lines extending in parallel to each other in a direction intersecting an end edge on a terminal side of the resin substrate along the terminal portion, the plurality of lead wiring lines being electrically connected to the plurality of terminals respectively,
a bending portion is provided between the display region and the terminal portion,
between the end edge on the terminal side and the terminal portion, the plurality of the inorganic insulating films is provided with a first opening penetrating the plurality of the inorganic insulating films and causing at least a part of an upper face of the resin substrate to be exposed,
a first filling layer is provided in an interior of the first opening to cover an edge portion of the first opening,
the plurality of lead wiring lines is provided near at least the end edge on the terminal side and is in contact with upper faces of the plurality of the inorganic insulating films and the first filling layer,
a first flattening film is provided on the plurality of lead wiring lines,
the first filling layer is provided to cover an end surface on the terminal side of the plurality of the inorganic insulating films, such that the plurality of the inorganic insulating films is not present on the end edge on the terminal side, and
an end surface of the plurality of lead wiring lines is exposed, at the end edge of the terminal side, from the first filling layer and the first flattening film.