US 12,446,390 B2
Stabilization of laser-structured organic photovoltaics
Ulrike Bewersdorff-Sarlette, Dresden (DE); Martin Pfeiffer-Jacob, Dresden (DE); Michiel Top, Dresden (DE); John Fahlteich, Dresden (DE); and Nicole Prager, Dresden (DE)
Assigned to HELIATEK GmbH, Dresden (DE); and Fraunhofer-Gesellschaft zur Förderung der angewanten Forschung e.V., Munich (DE)
Appl. No. 17/413,580
Filed by HELIATEK GmbH, Dresden (DE); and Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Munich (DE)
PCT Filed Dec. 16, 2019, PCT No. PCT/DE2019/101097
§ 371(c)(1), (2) Date Dec. 21, 2021,
PCT Pub. No. WO2020/119865, PCT Pub. Date Jun. 18, 2020.
Claims priority of application No. 10 2018 132 342.5 (DE), filed on Dec. 14, 2018.
Prior Publication US 2022/0310949 A1, Sep. 29, 2022
Int. Cl. H01L 31/00 (2006.01); H10K 30/81 (2023.01); H10K 30/88 (2023.01); H10K 71/20 (2023.01)
CPC H10K 30/81 (2023.02) [H10K 30/88 (2023.02); H10K 71/211 (2023.02)] 13 Claims
OG exemplary drawing
 
1. A method for stabilizing and encapsulating a laser-patterned organic photovoltaic (OPV) in a roll-to-roll process, comprising the following steps:
a. providing laser-patterned OPV, by applying a substrate electrode on a substrate, patterning the substrate electrode, applying an organic stack to the substrate electrode, patterning the organic stack, and applying a counterelectrode, wherein at least the organic stack and the substrate electrode on the substrate are laser-patterned;
b. forming from one or more precursors and a reaction gas a stabilization layer over the counterelectrode using a plasma enhanced chemical vapor deposition (PECVD) process, wherein the reaction gas comprises nitrogen and/or oxygen, wherein a ratio of a flow rate of the reaction gas to the one or more precursors is greater than 2 and less than 20, where a plasma power per sccm of the one or more precursors is greater than 15 and less than 80 W/sccm, wherein the stabilization layer is nanoporous and flexible and comprises:
silicon;
oxygen or nitrogen; and
carbon, wherein the stabilization layer has a pore size that is greater than zero and less than 50 nm; and
c. applying an encapsulation.