US 12,446,358 B2
Selective release and transfer of micro devices
Aaron Daniel Trent Wiersma, Kitchener (CA); and Pranav Prasad Gavirneni, Kitchener (CA)
Assigned to VueReal Inc., Waterloo (CA)
Appl. No. 17/614,193
Filed by VueReal Inc., Waterloo (CA)
PCT Filed May 25, 2020, PCT No. PCT/IB2020/054921
§ 371(c)(1), (2) Date Nov. 24, 2021,
PCT Pub. No. WO2020/240395, PCT Pub. Date Dec. 3, 2020.
Claims priority of provisional application 62/852,555, filed on May 24, 2019.
Prior Publication US 2022/0254950 A1, Aug. 11, 2022
Int. Cl. H10H 20/01 (2025.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H10H 20/814 (2025.01); H10H 20/819 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01)
CPC H10H 20/018 (2025.01) [H01L 25/0753 (2013.01); H10H 20/814 (2025.01); H10H 20/819 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H10H 20/034 (2025.01); H10H 20/0364 (2025.01)] 19 Claims
OG exemplary drawing
 
1. A method of integrating a plurality of micro devices on a system substrate comprising:
providing a donor substrate comprising the plurality of micro devices;
transferring the plurality of micro devices to an intermediate substrate;
aligning a set of selected micro devices of the plurality of micro devices on the intermediate substrate proximal to the system substrate;
moving the intermediate substrate to the system substrate so that each of the selected micro devices is in line with corresponding contact pads on the system substrate;
providing a photo-sensitive layer between the set of selected micro devices and the system substrate;
turning on the set of selected micro devices;
curing the photo-sensitive layer in between the set of selected micro devices and the system substrate by light emitted by the selected micro devices; and
bonding the set of selected micro devices to the corresponding contact pads on the system substrate,
wherein the step of providing the donor substrate comprising the plurality of micro devices comprises:
fabricating the plurality of micro devices on the donor substrate;
mounting reflectors on sidewalls of the plurality of micro devices on the donor substrate;
depositing a sacrificial layer conformally on or over the plurality of micro devices;
providing a planarization layer on and over the plurality of micro devices; and
forming one of a plurality of openings and vias into the planarizing layer down to the sacrificial layer for forming openings on top of the plurality of micro devices for connecting to the intermediate substrate.