US 12,446,356 B2
Display transfer structure and method of manufacturing the same
Seogwoo Hong, Yongin-si (KR); Hyunjoon Kim, Seoul (KR); Joonyong Park, Suwon-si (KR); Kyungwook Hwang, Suwon-si (KR); and Junsik Hwang, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Sep. 20, 2021, as Appl. No. 17/479,706.
Claims priority of provisional application 63/125,593, filed on Dec. 15, 2020.
Claims priority of application No. 10-2021-0042808 (KR), filed on Apr. 1, 2021.
Prior Publication US 2022/0190193 A1, Jun. 16, 2022
Int. Cl. H10H 20/01 (2025.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01)
CPC H10H 20/01 (2025.01) [H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 2221/68309 (2013.01); H10H 20/032 (2025.01); H10H 20/0361 (2025.01)] 12 Claims
OG exemplary drawing
 
1. A display transfer structure comprising:
a base layer;
a flexible barrier rib positioned on the base layer, the flexible barrier rib having a plurality of holes; and
a plurality of micro light emitting diodes (LEDs) respectively positioned in the plurality of holes,
wherein each of the plurality of micro LEDs comprises a surface facing an outside of the plurality of holes, and
wherein for each of the plurality of micro LEDs, at least one electrode is positioned on the surface,
wherein the flexible barrier rib comprises:
a polymer layer positioned on the base layer; and
a metal layer positioned on the polymer layer and spatially spaced apart from each of the at least one electrode of each of the plurality of electrodes, and the metal layer includes discontinuities to expose side surfaces at the discontinuities within the plurality of holes, and
wherein the metal layer does not overlap with the plurality of micro LEDs that respectively contacts the base layer within the plurality of holes in the thickness direction of the base layer,
wherein a height of an upper surface of the at least one electrode is greater than that of an upper surface of the metal layer for each of the plurality of micro LEDs to be transferred to a target substrate.