US 12,446,342 B2
Imaging element and imaging apparatus
Yuichi Seki, Kumamoto (JP); and Yoichi Ootsuka, Kumamoto (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Jun. 16, 2022, as Appl. No. 17/842,570.
Application 17/842,570 is a continuation of application No. 16/610,668, granted, now 11,404,462, previously published as PCT/JP2018/017515, filed on May 2, 2018.
Claims priority of application No. 2017-103469 (JP), filed on May 25, 2017.
Prior Publication US 2022/0310689 A1, Sep. 29, 2022
Int. Cl. H01L 27/146 (2006.01); G02B 5/20 (2006.01); H10F 39/00 (2025.01); H04N 23/12 (2023.01)
CPC H10F 39/8053 (2025.01) [G02B 5/20 (2013.01); H10F 39/8023 (2025.01); H04N 23/12 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An imaging element, comprising:
a plurality of pixels each comprising a color filter configured to transmit incident light having a predetermined wavelength, and a photoelectric conversion section configured to produce an electric charge according to the incident light transmitted through the color filter;
an incident light attenuation section that is disposed between color filters of adjacent pixels, and configured to be different in surface height than the color filters,
wherein the plurality of pixels comprises a first pixel comprising a first color filter configured to transmit the incident light having a first predetermined wavelength, and
wherein the incident light attenuation section is configured to transmit the incident light having the first predetermined wavelength; and
an on-chip lens disposed adjacent to each of the color filters based on the plurality of pixels and disposed directly onto the incident light attenuation section.