US 12,446,334 B2
Manufacturing method of radiation imaging apparatus
Yoshito Sasaki, Tokyo (JP); Tamaki Kobayashi, Kanagawa (JP); Masato Ofuji, Gunma (JP); Tomoyuki Oike, Kanagawa (JP); and Masao Ina, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Jul. 27, 2023, as Appl. No. 18/360,027.
Claims priority of application No. 2022-130123 (JP), filed on Aug. 17, 2022.
Prior Publication US 2024/0063247 A1, Feb. 22, 2024
Int. Cl. H10F 39/00 (2025.01); G01T 1/202 (2006.01); H10F 39/18 (2025.01)
CPC H10F 39/011 (2025.01) [G01T 1/2023 (2013.01); H10F 39/1898 (2025.01); H10F 39/804 (2025.01)] 13 Claims
OG exemplary drawing
 
1. A manufacturing method of a radiation imaging apparatus in which a sensor substrate and a scintillator are bonded by a bonding member, the method comprising:
forming, on a support substrate, a functional layer including a moisture preventing layer configured to suppress permeation of water;
forming the scintillator on the support substrate with the functional layer arranged thereon;
bonding the sensor substrate and the scintillator via the bonding member; and
separating, from the support substrate, at least a part of the scintillator together with the functional layer,
wherein:
the separating is performed after the bonding;
in the bonding, a part of the scintillator is bonded to the sensor substrate;
in the separating, the part of the scintillator and the functional layer are separated from the support substrate, and a remaining part of the scintillator remains on the support substrate; and
the remaining part of the scintillator is in contact with the support substrate without intervening the functional layer.