US 12,446,317 B2
Driving substrate and display device
Zeyao Li, Shenzhen (CN); and Rongrong Li, Shenzhen (CN)
Assigned to HKC CORPORATION LIMITED, Shenzhen (CN)
Filed by HKC CORPORATION LIMITED, Shenzhen (CN)
Filed on Jun. 13, 2023, as Appl. No. 18/208,892.
Claims priority of application No. 202211354800.4 (CN), filed on Oct. 31, 2022.
Prior Publication US 2024/0145486 A1, May 2, 2024
Int. Cl. H01L 33/62 (2010.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/857 (2025.01)
CPC H10D 86/60 (2025.01) [H10D 86/441 (2025.01); H10H 20/857 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A driving substrate, comprising:
a base;
a first metal layer, arranged on one side of the base, wherein the first metal layer comprises a first wiring;
a first insulation layer, arranged on one side of the first metal layer away from the base and covering the first metal layer;
a second metal layer, arranged on one side of the first insulation layer away from the base, wherein the second metal layer comprises a second wiring;
a second insulation layer, arranged on one side of the second metal layer away from the base and covering the second metal layer; wherein the first insulation layer and the second insulation layer define a first through hole to expose a part of the first wiring; and the second insulation layer defines a second through hole to expose a part of the second wiring;
a connection layer, arranged on one side of the second insulation layer away from the base, wherein a part of the connection layer extends into the first through hole to form a first conductive hole, and another part of the connection layer extends into the second through hole to form a second conductive hole to allow the electrical connection of the first wiring and the second wiring through the connection layer; and one first conductive hole and one second conductive hole form a group of conductive connection holes;
wherein, the driving substrate comprises multiple groups of conductive connection holes, each group of conductive connection holes have an intra-group current path and an extra-group path; in each group of the conductive connection holes, a current path formed by the first conductive hole passing through the connection layer to the corresponding second conductive hole is the intra-group current path; a current path formed by the first conductive hole in one group of conductive connection holes passing through the connection layer to the second conductive hole in any other group of conductive connection holes is the extra-group path; and
wherein the length of the intra-group current path of the conductive connection hole is smaller than the length of the extra-group current path in each group; and the length of the intra-group current path of one group of conductive connection holes is equal to the length of the intra-group current path of any other group of conductive connection holes.