US 12,446,311 B2
Array substrate and display terminal
Chi Zhang, Hubei (CN); Yun Xiang, Hubei (CN); Jian Tao, Hubei (CN); and Yafeng Li, Hubei (CN)
Assigned to WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Hubei (CN)
Appl. No. 17/622,791
Filed by WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Hubei (CN)
PCT Filed Dec. 17, 2021, PCT No. PCT/CN2021/139305
§ 371(c)(1), (2) Date Dec. 24, 2021,
PCT Pub. No. WO2023/108647, PCT Pub. Date Jun. 22, 2023.
Claims priority of application No. 202111522737.6 (CN), filed on Dec. 13, 2021.
Prior Publication US 2024/0038780 A1, Feb. 1, 2024
Int. Cl. H01L 27/12 (2006.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01)
CPC H10D 86/60 (2025.01) [H10D 86/451 (2025.01); H10D 86/421 (2025.01)] 18 Claims
OG exemplary drawing
 
1. An array substrate, comprising:
an underlay;
a light shielding layer disposed on the underlay, wherein the light shielding layer comprises a plurality of light shielding portions spaced from one another;
an active layer disposed on the light shielding layer, wherein the active layer disposed on a plurality of active portions spaced from one another, the active portions correspond to the light shielding portions; and
a bridge element disposed on the active layer, wherein adjacent two of the active portions are electrically connected to each other through the bridge element, a toughness of the bridge element is greater than a toughness of the active portions;
wherein an orthographic projection of the active portion on a corresponding one of the light shielding portions is located fully within the light shielding portion;
wherein in a direction perpendicular to the array substrate, a thickness of the bridge element is greater than a thickness of the light shielding layer;
wherein the thickness of the bridge element is greater than 4000 Å.