US 12,446,299 B2
Combined MOS/MIS capacitor assembly
Cory Nelson, Simpsonville, SC (US)
Assigned to KYOCERA AVX Components Corporation, Fountain Inn, SC (US)
Filed by KYOCERA AVX Components Corporation, Fountain Inn, SC (US)
Filed on Oct. 20, 2022, as Appl. No. 17/969,835.
Claims priority of provisional application 63/274,102, filed on Nov. 1, 2021.
Prior Publication US 2023/0326923 A1, Oct. 12, 2023
Int. Cl. H10D 84/00 (2025.01); H10D 1/68 (2025.01)
CPC H10D 84/217 (2025.01) [H10D 1/692 (2025.01)] 16 Claims
OG exemplary drawing
 
1. A capacitor assembly comprising:
a substrate comprising a semiconductor material;
an oxide layer formed on a surface of the substrate;
an insulator layer formed over at least a portion of the oxide layer;
a first conductive layer formed over at least a portion of the oxide layer;
a second conductive layer formed over at least a portion of the insulator layer;
a first terminal connected with the first conductive layer;
a second terminal connected with the second conductive layer; and
a third terminal connected with the substrate;
wherein the oxide layer is connected in series between the substrate and the first conductive layer to form a first capacitor between the first terminal and the third terminal; and
wherein the insulator layer is connected in series between the substrate and the second conductive layer to form a second capacitor between the second terminal and the third terminal.