US 12,446,262 B2
Semiconductor devices
Gyeom Kim, Suwon-si (KR); Jinbum Kim, Suwon-si (KR); Dahye Kim, Suwon-si (KR); and Kyungbin Chun, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 30, 2023, as Appl. No. 18/128,417.
Claims priority of application No. 10-2022-0079522 (KR), filed on Jun. 29, 2022.
Prior Publication US 2024/0006503 A1, Jan. 4, 2024
Int. Cl. H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/775 (2006.01); H01L 29/786 (2006.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 64/01 (2025.01)
CPC H10D 30/6735 (2025.01) [H10D 30/43 (2025.01); H10D 30/6757 (2025.01); H10D 62/121 (2025.01); H10D 64/017 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a substrate comprising an active region extending in a first direction;
a gate structure extending in a second direction and intersecting the active region, on the substrate;
a plurality of channel layers on the active region, spaced apart from each other in a third direction perpendicular to an upper surface of the substrate, and surrounded by the gate structure; and
a source/drain region on the active region adjacent the gate structure and connected to the plurality of channel layers,
wherein the source/drain region comprises:
a first semiconductor layer on side surfaces of the plurality of channel layers;
a diffusion barrier layer on an upper region of the first semiconductor layer and comprising carbon, wherein an upper surface of a first channel layer that is a lowermost channel layer among the plurality of channel layers is provided between the substrate and a lower end of the diffusion barrier layer; and
a second semiconductor layer on the diffusion barrier layer and the first semiconductor layer.