US 12,446,194 B2
Multiple PCB cooling module assembly
Michael Darrill Moore, Senoia, GA (US)
Assigned to Panasonic Automotive Systems America, LLC., Peachtree City, GA (US)
Filed by Panasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America, Peachtree City, GA (US)
Filed on Sep. 25, 2023, as Appl. No. 18/473,827.
Claims priority of provisional application 63/413,889, filed on Oct. 6, 2022.
Prior Publication US 2024/0121918 A1, Apr. 11, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/2049 (2013.01) [H05K 7/20272 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling arrangement for electronics, the arrangement comprising:
a plurality of modular electronics enclosures, each modular electronics enclosure including:
at least one electronic component; and
a heat sink engaging the electronic component; and
a cold box having a plurality of recesses, each of the recesses being at least partially defined by at least one corresponding wall having at least one channel therein carrying liquid coolant, each of the recesses receiving a respective one of the modular electronics enclosures, the cold box including a plurality of springs each biasing a respective said heat sink of a respective said modular electronics enclosure against a corresponding said wall.