US 12,446,193 B2
Heat-dissipating structure
Junya Mishima, Kyoto (JP); and Tomoyuki Hakata, Kyoto (JP)
Assigned to OMRON CORPORATION, Kyoto (JP)
Appl. No. 18/022,383
Filed by OMRON Corporation, Kyoto (JP)
PCT Filed Sep. 2, 2021, PCT No. PCT/JP2021/032317
§ 371(c)(1), (2) Date Feb. 21, 2023,
PCT Pub. No. WO2022/054691, PCT Pub. Date Mar. 17, 2022.
Claims priority of application No. 2020-153167 (JP), filed on Sep. 11, 2020.
Prior Publication US 2024/0040749 A1, Feb. 1, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/2039 (2013.01) 8 Claims
OG exemplary drawing
 
1. A heat-dissipating structure configured to dispose between a heating element and a heat dissipation member, the heat dissipation member being configured to dissipate heat generated by the heating element, the heat-dissipating structure comprising:
a board configured to be attached to the heating element;
a resin layer provided between the board and the heat dissipation member, the resin layer being attached to the board; and
at least one heat transfer portion configured to transfer heat generated by the heating element to the heat dissipation member through the resin layer, wherein
the at least one heat transfer portion includes:
a heat transfer member, which is plate-shaped, provided between the board and the resin layer, the heat transfer member extending along the board, and
a conductive layer provided between the board and the resin layer and across the board and the heat transfer member, the conductive layer being partially disposed between the heat transfer member and the resin layer.