| CPC H05K 7/20327 (2013.01) [F28D 15/0266 (2013.01); H01L 23/427 (2013.01); H05K 7/20309 (2013.01); H05K 7/2039 (2013.01); F28F 2215/06 (2013.01)] | 16 Claims |

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1. A heat dissipating device comprising:
a thermal board having
at least two chambers formed inside the thermal board; said at least two chambers each having
a first inlet connected to an end of the respective chamber; and
at least one first outlet connected to another end of the respective chamber through an outlet recess corresponding to each of the at least two chambers;
a first evaporating section adjacent to the first inlet;
a second evaporating section adjacent to the at least one first outlet;
a passive one-way valve section located between the first evaporating section and the second evaporating section; the first evaporating section, the passive one-way valve section, and the second evaporating section being sequentially connected to each other;
at least two cooling fins each having
an inner space;
at least one second inlet and a second outlet formed by the inner space; the at least one second inlet being connected to the at least one first outlet; the second outlet connected to the first inlet; and
a working fluid filled in the at least two chambers and the inner spaces of the at least two colling fins; the passive one-way valve section configured to limit the working fluid to cycle in the at least two chambers of the thermal board and the inner spaces of the at least one-two cooling fins along a single direction,
wherein the outlet recess fluidly connected to a first chamber of said at least two chambers and the outlet recess fluidly connected to a second chamber of said at least two chambers are fluidly separated from each other.
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