US 12,446,187 B2
Heat dissipation system and electronic device
Jianliang Wang, Dongguan (CN); Along Zhou, Yokohama (JP); Huipeng Wu, Dongguan (CN); Jian Shi, Shanghai (CN); and Shoubiao Xu, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Appl. No. 18/564,897
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
PCT Filed May 26, 2022, PCT No. PCT/CN2022/095180
§ 371(c)(1), (2) Date Nov. 28, 2023,
PCT Pub. No. WO2022/253091, PCT Pub. Date Dec. 8, 2022.
Claims priority of application No. 202110595876.5 (CN), filed on May 29, 2021.
Prior Publication US 2024/0389264 A1, Nov. 21, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20272 (2013.01) 20 Claims
OG exemplary drawing
 
1. A heat dissipation system comprising:
a first heat dissipation panel comprising a first liquid channel comprising:
a first interface; and
a second interface;
a second heat dissipation panel comprising a second liquid channel comprising:
a third interface; and
a fourth interface;
a first rotating shaft assembly comprising:
a first rotating shaft rotatably coupled with a second rotating shaft, wherein the second rotating shaft is a first hollow shaft, wherein the second interface is coupled to the third interface through the second rotating shaft;
a second rotating shaft assembly comprising:
a third rotating shaft rotatably coupled with a fourth rotating shaft, wherein the fourth rotating shaft is a second hollow shaft; and
a driving apparatus comprising:
a liquid outlet coupled to the first interface; and
a liquid inlet, wherein the fourth interface is coupled to the liquid inlet through the fourth rotating shaft,
wherein the driving apparatus is configured to drive a liquid medium to flow in the first liquid channel, the second liquid channel, the second rotating shaft, and the fourth rotating shaft.