| CPC H05K 7/20272 (2013.01) [H05K 7/20236 (2013.01); H05K 7/2039 (2013.01); H05K 7/20772 (2013.01)] | 16 Claims |

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1. A nozzle device comprising:
a nozzle for discharging liquid coolant; and
a mount configured to disperse the liquid coolant, the mount further configured to be coupled with an electronic component;
wherein the nozzle is coupled to the mount such that, in use, the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount;
a container housing a plurality of heat generating components, the heat generating components comprising one or more low temperature components, median temperature components, and high temperature components;
wherein the nozzle is configured to direct the liquid coolant onto a median temperature component;
a heat sink mounted on or around a high temperature component, the heat sink comprising a volume defined by a base and a retaining wall, and the nozzle for directing the liquid coolant into the volume, and
a level of liquid coolant in the container for at least partially immersing the one or more low temperature components, wherein the level of liquid coolant in the volume is higher than the level of liquid coolant in the container.
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