US 12,446,184 B2
Information handling system serial thermal solution with motherboard engagement
John Trevor Morrison, Round Rock, TX (US); Chiu-Jung Tsen, Zhubei (TW); Jace W. Files, Round Rock, TX (US); Jheng-Ting Ye, New Taipei (TW); Yi-Ming Chou, Taipei (TW); and Hsu-Feng Lee, Taipei (TW)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Dec. 14, 2022, as Appl. No. 18/081,162.
Prior Publication US 2024/0206113 A1, Jun. 20, 2024
Int. Cl. H05K 7/20 (2006.01); G06F 1/18 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20172 (2013.01) [G06F 1/184 (2013.01); G06F 1/203 (2013.01); H05K 7/20209 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An information handling system comprising:
a housing;
a motherboard coupled to the housing;
a processor coupled to the motherboard and operable to execute instructions that process information;
a memory coupled to the motherboard and interfaced with the processor, the memory operable to store the instructions and information; and
plural cooling fans, each of the plural cooling fans having a first cooling fan connector at a first side, a second cooling fan connector at a second side opposite the first side, first and second of the plural cooling fan interfacing between the first and second cooling fan connectors to communicate power and fan speed commands between the first and second cooling fans when a first cooling fan connector couples to a second cooling fan connector in series.