US 12,446,176 B2
Electronic device housing
Shinichiro Akieda, Tokyo (JP); Takuro Tanabe, Tokyo (JP); and Tamotsu Koike, Tokyo (JP)
Assigned to FCL Components Limited, Tokyo (JP)
Filed by FCL Components Limited, Tokyo (JP)
Filed on Jul. 11, 2023, as Appl. No. 18/350,436.
Claims priority of application No. 2022-119912 (JP), filed on Jul. 27, 2022.
Prior Publication US 2024/0040728 A1, Feb. 1, 2024
Int. Cl. H05K 5/06 (2006.01); F16J 15/10 (2006.01); H04M 1/02 (2006.01); H04M 1/18 (2006.01)
CPC H05K 5/061 (2013.01) [H05K 5/069 (2013.01); F16J 15/104 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A housing for housing an electronic device, the housing comprising:
an upper case and a lower case which are formed so as to mate with each other,
a gasket arranged between the upper case and the lower case,
an elastically deformable cantilever which is formed on one of the upper case and the lower case and which has a hook, and
an engagement portion formed on the other of the upper case and the lower case,
wherein the upper case and the lower case each have a peripheral wall,
wherein the gasket is arranged between the peripheral walls of the upper case and the lower case,
wherein the cantilever is formed so as to protrude from a distal end of the peripheral wall of the one of the upper case and the lower case,
wherein when an operation to mate the upper case and the lower case is performed, before the cantilever is completely engaged with the engagement portion, a gap between the upper case and the lower case is sealed by the gasket.