US 12,446,174 B2
Interfaces for coupling a memory module to a circuit board, and associated devices, modules, and systems
Anthony D. Veches, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on May 17, 2024, as Appl. No. 18/667,116.
Application 18/667,116 is a division of application No. 17/804,789, filed on May 31, 2022, granted, now 12,004,314.
Prior Publication US 2024/0306331 A1, Sep. 12, 2024
Int. Cl. H05K 5/00 (2025.01); H01R 12/70 (2011.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01); H05K 1/14 (2006.01)
CPC H05K 5/026 (2013.01) [H01R 12/7076 (2013.01); H05K 5/0286 (2013.01); H05K 7/20763 (2013.01); H05K 1/14 (2013.01); H05K 1/142 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A device comprising:
a server comprising:
a card comprising:
a circuit board, a first major surface of the circuit board substantially in a first plane and a first side surface of the circuit board at least substantially perpendicular to the first major surface of the circuit board; and
a memory module electrically coupled to the circuit board, a second major surface of the memory module in a second plane, the second plane substantially parallel to the first plane and a second side surface of the memory module at least substantially perpendicular to the second major surface of the memory module and in contact with the first side surface of the circuit board.