US 12,446,167 B2
Circuit assembly
Taiji Yanagida, Osaka (JP); and Hiroki Shimoda, Osaka (JP)
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/265,581
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Dec. 14, 2021, PCT No. PCT/JP2021/045973
§ 371(c)(1), (2) Date Jun. 6, 2023,
PCT Pub. No. WO2022/138314, PCT Pub. Date Jun. 30, 2022.
Claims priority of application No. 2020-213262 (JP), filed on Dec. 23, 2020.
Prior Publication US 2024/0032210 A1, Jan. 25, 2024
Int. Cl. H05K 5/00 (2025.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 5/03 (2006.01)
CPC H05K 5/0069 (2013.01) [H05K 1/0212 (2013.01); H05K 1/05 (2013.01); H05K 5/03 (2013.01); H05K 2201/0206 (2013.01); H05K 2201/06 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A circuit assembly comprising:
at least one heat-generating component that generates heat as a result of a current flowing therethrough;
a case accommodating the at least one heat-generating component;
at least one metal plate connected to a connecting portion of the at least one heat-generating component, and having a heat-dissipating portion exposed to an outside of the case and configured to come into thermal contact with an external heat-dissipation target;
an insulating film covering a contact surface of the heat-dissipating portion, the contact surface being configured to come into contact with the heat-dissipation target; and
a thermal conductive filling member that is in thermal contact with the heat-dissipating portion via the insulating film and disposed between the insulating film and the heat-dissipation target.