US 12,446,163 B2
Printed circuit board and method for manufacturing the same
Mo Ses Cho, Suwon-si (KR); Chang Gun Oh, Suwon-si (KR); and Je Sang Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 31, 2022, as Appl. No. 17/899,989.
Claims priority of application No. 10-2021-0180525 (KR), filed on Dec. 16, 2021.
Prior Publication US 2023/0199975 A1, Jun. 22, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 3/46 (2006.01)
CPC H05K 3/4644 (2013.01) [H05K 1/115 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first insulating layer;
a circuit pattern protruding from an upper surface of the first insulating layer in a thickness direction and having recesses in side surfaces thereof; and
a metal portion covering an upper surface and at least a portion of each of the side surfaces of the circuit pattern,
wherein the recesses are thinner than a portion of the circuit pattern extending from the recesses in the thickness direction,
wherein at least a portion of the side surfaces extend inwardly from the upper surface of the first insulating layer to a lower surface of the circuit pattern arranged between the upper surface of the circuit pattern and the at least a portion of the side surfaces in the thickness direction, and
wherein a thickness of the at least a portion of the side surfaces is less than a thickness of a remaining portion of the circuit pattern above the lower surface of the circuit pattern.