US 12,446,159 B2
Electronic circuit module
Yoshihito Otsubo, Nagaokakyo (JP); and Hirofumi Oie, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Nov. 21, 2023, as Appl. No. 18/515,892.
Application 18/515,892 is a continuation of application No. PCT/JP2022/007683, filed on Feb. 24, 2022.
Claims priority of application No. 2021-088627 (JP), filed on May 26, 2021.
Prior Publication US 2024/0090134 A1, Mar. 14, 2024
Int. Cl. H05K 1/18 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 2201/0212 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/095 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10287 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic circuit module comprising:
a substrate;
a first electronic component mounted on one main surface of the substrate;
a substrate electrode provided on the one main surface;
a second electronic component supported on a support surface opposite to a surface facing the one main surface of the first electronic component;
a conductor provided on the support surface of the first electronic component;
a wire connected to the conductor and the substrate electrode;
a component electrode provided on a surface of the second electronic component and electrically connected to the conductor; and
a first sealing resin provided on the one main surface and covering at least a part of the first electronic component, at least a part of the wire, and a part of the second electronic component,
wherein
the second electronic component is supported on the support surface of the first electronic component via the component electrode,
the component electrode is connected to the conductor,
the second electronic component includes an external electrode disposed on a surface opposite to a surface facing the support surface of the first electronic component, and
at least a part of the external electrode is exposed to an outside.