US 12,446,158 B2
Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules
Boon Yew Low, Subang Jaya (MY); Fui Yee Lim, Sunway SPK (MY); Fernando A. Santos, Chandler, AZ (US); and Dominic (PohMeng) Koey, Shah Alam (MY)
Assigned to NXP USA, INC., Austin, TX (US)
Filed by NXP USA, Inc., Austin, TX (US)
Filed on Oct. 13, 2023, as Appl. No. 18/486,179.
Prior Publication US 2025/0126716 A1, Apr. 17, 2025
Int. Cl. H05K 3/28 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 1/0209 (2013.01); H05K 3/284 (2013.01); H05K 2201/0311 (2013.01); H05K 2201/09409 (2013.01); H05K 2203/1305 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A circuit module comprising:
a module substrate with a mounting surface and a plurality of conductive features at the mounting surface;
electronic circuitry coupled to the mounting surface of the module substrate; encapsulant material covering the electronic circuitry and the mounting surface of the module substrate, wherein an upper surface of the encapsulant material defines a first surface of the circuit module, and wherein encapsulant divots extend into the encapsulant material from the first surface, and surfaces of the encapsulant divots are defined by the encapsulant material;
a plurality of leadframe terminals extending from the conductive features at the mounting surface through the encapsulant material toward the first surface of the circuit module, wherein each of the leadframe terminals is formed from an elongated planar conductive feature of a leadframe unit, wherein the plurality of leadframe terminals is electrically coupled to the electronic circuitry through the conductive features and the module substrate, and wherein proximal ends of the leadframe terminals terminate at and are exposed in the encapsulant divots; and conductive attachment material coupled to the proximal ends of the leadframe terminals within the encapsulant divots.