US 12,446,157 B2
Module
Yoshihito Otsubo, Nagaokakyo (JP); and Minoru Komiyama, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto-Fu (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Dec. 9, 2022, as Appl. No. 18/063,794.
Application 18/063,794 is a continuation of application No. PCT/JP2021/021338, filed on Jun. 4, 2021.
Claims priority of application No. 2020-103942 (JP), filed on Jun. 16, 2020.
Prior Publication US 2023/0105635 A1, Apr. 6, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 1/113 (2013.01); H05K 2201/0364 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/10931 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate having a first surface;
one or more components mounted on the first surface;
a resin film covering the one or more components along a shape of the one or more components and covering a part of the first surface;
a first shield film provided to overlap the resin film; and
a sealing resin disposed to cover the first surface, the one or more components, and the first shield film, wherein
a stack including the resin film and the first shield film has a first opening penetrating both the resin film and the first shield film,
a first columnar conductor is disposed to be electrically connected to the first surface through the sealing resin and the first opening, and
the first shield film is electrically connected to the first columnar conductor in the first opening.