US 12,446,156 B2
Network device with elevated temperature sensor
Eric Jau Heng Tse, Mountain View, CA (US); Arshdeep Kaur, Santa Clara, CA (US); Andrew D Boyko, Sunnyvale, CA (US); Xin Xue, San Jose, CA (US); and Richard Neville Hibbs, Carmel-by-the-Sea, CA (US)
Assigned to Arista Networks, Inc., Santa Clara, CA (US)
Filed by Arista Networks, Inc., Santa Clara, CA (US)
Filed on May 19, 2023, as Appl. No. 18/320,730.
Prior Publication US 2024/0389233 A1, Nov. 21, 2024
Int. Cl. H05K 1/14 (2006.01); G06F 13/38 (2006.01); G06F 13/42 (2006.01); H05K 1/18 (2006.01); H01R 12/79 (2011.01)
CPC H05K 1/142 (2013.01) [G06F 13/382 (2013.01); G06F 13/4282 (2013.01); H05K 1/183 (2013.01); G06F 2213/0042 (2013.01); H01R 12/79 (2013.01); H05K 2201/10151 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a host printed circuit board;
a port protruding from a surface of the host printed circuit board and disposed at a first location on the host printed circuit board; and
a sensor module comprising
a sensor printed circuit board, and
a sensor integrated circuit disposed on a first planar surface of the sensor printed circuit board, wherein the sensor module is configured to mate with the port, wherein the first planar surface of the sensor printed circuit board is in a fixed relation to the surface of the host printed circuit board, and wherein the sensor integrated circuit is suspended over a second location, different than the first location, on the host printed circuit board.