US 12,446,154 B2
Wiring board
Hidetoshi Yugawa, Kyoto (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Appl. No. 18/028,951
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Sep. 14, 2021, PCT No. PCT/JP2021/033701
§ 371(c)(1), (2) Date Mar. 28, 2023,
PCT Pub. No. WO2022/065134, PCT Pub. Date Mar. 31, 2022.
Claims priority of application No. 2020-161907 (JP), filed on Sep. 28, 2020.
Prior Publication US 2023/0337361 A1, Oct. 19, 2023
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/116 (2013.01) [H05K 2201/0209 (2013.01); H05K 2201/096 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A wiring board comprising:
a first insulation layer comprising a first surface;
a land located on the first insulation layer and comprising a second surface;
a second insulation layer located at the first surface of the first insulation layer and comprising a via hole extending over the second surface of the land; and
a via-hole electrical conductor located in the via hole, wherein
the land comprises a plurality of recessed portions on the second surface, and
a buffer body located entirely within a respective recessed portion selected from the plurality of recessed portions, wherein the buffer body is formed from a resin and is located between the via-hole electrical conductor and the second surface of the land, and
the via-hole electrical conductor is in contact with the second surface of the land and the buffer body.