US 12,446,152 B2
Electronic component
Takahiro Kitazume, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto-fu (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Oct. 2, 2023, as Appl. No. 18/479,406.
Application 18/479,406 is a continuation of application No. PCT/JP2022/005894, filed on Feb. 15, 2022.
Claims priority of application No. 2021-064914 (JP), filed on Apr. 6, 2021.
Prior Publication US 2024/0032193 A1, Jan. 25, 2024
Int. Cl. H05K 1/09 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/111 (2013.01) [H01L 23/49838 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/099 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic component comprising: a main body including a first surface; a first electrode and a second electrode arranged on the first surface; and a resist film arranged to isolate the first electrode from the second electrode, wherein the first electrode and the second electrode are mainly composed of a first material, the first electrode includes a first portion including a central portion and having a first thickness and a second portion having a second thickness less than the first thickness in at least a part of a peripheral portion, and the first portion is covered with a plated film where a film comprising a second material higher in affinity for solder than the first material is exposed at an outermost surface, wherein the second material is Au, wherein the plated film includes a two-layered structure composed of a Ni plated film and an Au plated film, at least a part of the second portion is covered with the resist film, wherein the first portion and the plated film are distant from the resist film.