| CPC H05K 1/0224 (2013.01) [H05K 1/115 (2013.01); H05K 2201/09636 (2013.01)] | 16 Claims |

|
1. A circuit board device, comprising:
a multilayer board structure comprising a plurality of sheet layers and a core layer sandwiched between the sheet layers, wherein a thickness of the core layer is greater than a thickness of each of the sheet layers;
a main ground disposed in the multilayer board structure; and
a circuit module comprising:
a first differential-signal portion disposed on the core layer, and comprising a first differential through-hole pair and a plurality of first ground through holes arranged at intervals to surround the first differential through-hole pair, and electrically connected to the main ground; and
a second differential-signal portion disposed on the core layer, and comprising a second differential through-hole pair and a plurality of second ground through holes arranged at intervals to surround the second differential through-hole pair, and electrically connected to the main ground,
wherein a pattern of the second differential-signal portion and a pattern of the first differential-signal portion are mirror symmetrical to each other based on an imaginary mirror line between the second differential-signal portion and the first differential-signal portion, and a minimum linear distance between the first differential-signal portion and the imaginary mirror line and a minimum linear distance between the second differential-signal portion and the imaginary mirror line are equal to each other.
|