US 12,446,144 B2
Circuit board module
Osamu Miki, Nagaokakyo (JP); and Tatsuya Hosotani, Nagaokakyo (JP)
Assigned to Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Sep. 18, 2022, as Appl. No. 17/933,116.
Application 17/933,116 is a continuation of application No. PCT/JP2020/043644, filed on Nov. 24, 2020.
Claims priority of application No. 2020-047121 (JP), filed on Mar. 18, 2020.
Prior Publication US 2023/0009649 A1, Jan. 12, 2023
Int. Cl. H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 25/16 (2023.01); H05K 1/14 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0206 (2013.01) [H01L 23/3675 (2013.01); H01L 25/16 (2013.01); H05K 1/144 (2013.01); H05K 7/209 (2013.01); H01L 23/3737 (2013.01); H05K 2201/042 (2013.01); H05K 2201/1003 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A circuit board module comprising:
a first circuit board having a first main surface on which an electronic component that generates heat when the electronic component operates is mounted and a second main surface;
a second circuit board having a third main surface on which the first circuit board is mounted and a fourth main surface; and
a first thermally-conductive sheet between the first circuit board and the second circuit board,
wherein
the first circuit board is mounted such that the second main surface faces the third main surface of the second circuit board,
the first circuit board includes thermally-conductive vias that extend between the first main surface and the second main surface, the thermally-conductive vias being densely distributed in a region near a mounting terminal of the electronic component and being filled with a thermally-conductive member,
the thermally-conductive vias are physically in contact with the first thermally-conductive sheet,
the first thermally-conductive sheet covers the third main surface of the second circuit board,
every thermally-conductive via included in the first circuit board is spaced apart from the electronic component, when viewed in plan view,
the second main surface of the first circuit board includes an insulating film,
the first thermally-conductive sheet is a graphite sheet, and
the thermally-conductive vias include both vias that conduct electricity through the graphite sheet and vias that are insulated by the insulating film.