US 12,445,790 B2
Reproducing audio signals with a haptic apparatus on acoustic headphones and their calibration and measurement
Rocky Chau-Hsiung Lin, Cupertino, CA (US); and Thomas Yamasaki, Anaheim Hills, CA (US)
Assigned to Alpine Electronics of Silicon Valley, Inc., Santa Clara, CA (US)
Filed by Alpine Electronics of Silicon Valley, Inc., Santa Clara, CA (US)
Filed on Mar. 11, 2024, as Appl. No. 18/601,961.
Application 18/601,961 is a continuation of application No. 17/813,280, filed on Jul. 18, 2022, granted, now 11,930,329.
Application 17/813,280 is a continuation of application No. 16/787,532, filed on Feb. 11, 2020, granted, now 11,395,078, issued on Jul. 19, 2022.
Application 16/787,532 is a continuation of application No. 15/669,823, filed on Aug. 4, 2017, granted, now 10,560,792, issued on Feb. 11, 2020.
Application 15/669,823 is a continuation of application No. 14/609,357, filed on Jan. 29, 2015, granted, now 9,729,985, issued on Aug. 8, 2017.
Application 14/609,357 is a continuation of application No. 14/512,679, filed on Oct. 13, 2014, granted, now 8,977,376, issued on Mar. 10, 2017.
Application 14/512,679 is a continuation in part of application No. 14/269,015, filed on May 2, 2014, granted, now 8,892,233, issued on Nov. 18, 2014.
Application 14/269,015 is a continuation of application No. 14/181,512, filed on Feb. 14, 2014, granted, now 8,767,996, issued on Jul. 1, 2014.
Claims priority of provisional application 61/924,148, filed on Jan. 6, 2014.
Prior Publication US 2024/0214755 A1, Jun. 27, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 29/00 (2006.01); G01H 11/06 (2006.01); G06F 3/16 (2006.01); H04R 1/10 (2006.01); H04R 1/22 (2006.01); H04R 3/04 (2006.01); H04R 31/00 (2006.01)
CPC H04R 29/00 (2013.01) [G01H 11/06 (2013.01); G06F 3/165 (2013.01); H04R 1/1008 (2013.01); H04R 1/1091 (2013.01); H04R 1/22 (2013.01); H04R 3/04 (2013.01); H04R 31/00 (2013.01); H04R 1/1041 (2013.01); H04R 2420/07 (2013.01); H04R 2460/13 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A headset, comprising:
a headband configured to be placed on a top of a head;
a first circumaural ear cup incorporating a first driver therein attached to one end of the headband, wherein the first driver is configured to receive a first audio channel of an audio signal;
a second circumaural ear cup incorporating a second driver therein, attached to an opposite end of the headband and oriented to face back toward the first circumaural ear cup, wherein the second driver is configured to receive a second audio channel of the audio signal;
a signal processor configured to receive at least one of the first and second audio channels;
a first haptic device incorporated in the first circumaural ear cup, wherein the first haptic device is a first mono, low-frequency driver configured to receive the first audio channel; and
a second haptic device incorporated in the second circumaural ear cup, wherein the second haptic device is a second mono, low-frequency driver configured to receive the second audio channel.