US 12,445,160 B2
Sim module management method and electronic device
Jing Han, Beijing (CN); Xiaoquan Zhang, Beijing (CN); Haifeng Zhang, Beijing (CN); Qiang Tao, Beijing (CN); Tao Li, Beijing (CN); and Jilei Liu, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Appl. No. 17/925,936
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
PCT Filed May 11, 2021, PCT No. PCT/CN2021/092952
§ 371(c)(1), (2) Date Nov. 17, 2022,
PCT Pub. No. WO2021/233159, PCT Pub. Date Nov. 25, 2021.
Claims priority of application No. 202010417129.8 (CN), filed on May 18, 2020.
Prior Publication US 2023/0188172 A1, Jun. 15, 2023
Int. Cl. H04B 1/38 (2015.01); H04B 1/3818 (2015.01)
CPC H04B 1/3818 (2015.01) 13 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first modem,
a second modem,
a mobile communication module,
a first subscriber identity module (SIM) module interface,
a second SIM module interface,
an embedded universal integrated circuit card (eUICC) configured to store an embedded subscriber identity module (eSIM) module, a first smart card interface (SCI), and a second SCI; and
a processor coupled to the first modem, the second modem, the mobile communication module, the first SIM module interface, the second SIM module interface, and the eUICC, wherein
one end of the first SCI is coupled to the processor, and the other end is coupled to the second SIM module interface and the eUICC;
one end of the second SCI is coupled to the processor, and the other end is coupled to the first SIM module interface and the eUICC; and
the processor is configured to control a connection relationship between the first SIM module interface, the second SIM module interface, and the eUICC and the first modem and the second modem.