US 12,445,159 B2
Radio frequency module and communication device
Takanori Uejima, Kyoto (JP); and Hiromichi Kitajima, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Apr. 19, 2023, as Appl. No. 18/302,858.
Application 18/302,858 is a continuation of application No. PCT/JP2021/036701, filed on Oct. 4, 2021.
Claims priority of application No. 2020-189602 (JP), filed on Nov. 13, 2020.
Prior Publication US 2023/0308128 A1, Sep. 28, 2023
Int. Cl. H04B 1/38 (2015.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 25/18 (2023.01); H03H 9/05 (2006.01)
CPC H04B 1/38 (2013.01) [H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 25/18 (2013.01); H03H 9/0566 (2013.01); H01L 2223/6655 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio frequency module comprising:
a module substrate;
a first component disposed on a principal surface of the module substrate;
a first metal wall disposed on an upper surface of the first component and set to ground potential;
a resin member covering the principal surface of the module substrate, the upper surface and a side surface of the first component, and a side surface of the first metal wall; and
a metal layer set to the ground potential and covering an upper surface of the resin member,
wherein an upper end of the first metal wall is in contact with the metal layer,
the first component includes a first terminal and a second terminal both connected to the module substrate, and
when the principal surface is viewed in plan, the first metal wall is disposed between the first terminal and the second terminal.