US 12,445,111 B2
High frequency module and communication device
Keisuke Nishio, Kyoto (JP); Masanori Kato, Kyoto (JP); and Syunsuke Kido, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Aug. 29, 2023, as Appl. No. 18/457,444.
Application 18/457,444 is a continuation of application No. PCT/JP2022/007469, filed on Feb. 24, 2022.
Claims priority of application No. 2021-033005 (JP), filed on Mar. 2, 2021; and application No. 2021-094425 (JP), filed on Jun. 4, 2021.
Prior Publication US 2023/0402996 A1, Dec. 14, 2023
Int. Cl. H03H 9/64 (2006.01); H03H 9/54 (2006.01)
CPC H03H 9/6433 (2013.01) [H03H 9/542 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A high frequency module comprising:
a mounting substrate having a first principal surface and a second principal surface that are opposed to each other;
a first signal terminal, a second signal terminal, and a ground terminal that are on the mounting substrate; and
a hybrid filter coupled between the first signal terminal and the second signal terminal, wherein the hybrid filter comprises:
an acoustic wave filter comprising at least one acoustic wave resonator;
a first inductor; and
a capacitor,
wherein a pass band width of the hybrid filter is larger than a pass band width of the acoustic wave resonator,
wherein the acoustic wave filter is on the first principal surface of the mounting substrate,
wherein the first inductor and the capacitor are in or on the mounting substrate, and
wherein the high frequency module further comprises:
a resin layer that is on the first principal surface of the mounting substrate and that covers at least part of the acoustic wave filter;
a metal electrode layer that covers at least part of the resin layer and that is coupled to the ground terminal; and
a second inductor that is in or on the mounting substrate, and that is coupled in series between the hybrid filter and the second signal terminal.