US 12,445,106 B2
Acoustic wave device
Akihiro Iyama, Nagaokakyo (JP); and Yuta Ishii, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 19, 2023, as Appl. No. 18/369,897.
Application 18/369,897 is a continuation of application No. PCT/JP2022/016189, filed on Mar. 30, 2022.
Claims priority of provisional application 63/169,282, filed on Apr. 1, 2021.
Prior Publication US 2024/0014801 A1, Jan. 11, 2024
Int. Cl. H03H 9/17 (2006.01); H03H 9/02 (2006.01)
CPC H03H 9/174 (2013.01) [H03H 9/02015 (2013.01); H03H 9/02228 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave device comprising:
a support substrate;
a piezoelectric layer located on the support substrate and including a first main surface and a second main surface on opposite sides;
a functional electrode located on the first main surface or the second main surface of the piezoelectric layer;
a first trace located on the piezoelectric layer and connected to the functional electrode;
a second trace located on the piezoelectric layer and facing the first trace, the first and second traces being connected to different potentials; and
an attenuation layer located between the first trace and the second trace when viewed in plan, the attenuation layer being made of a dielectric material lower in density than the piezoelectric layer.