US 12,444,906 B2
Heterogeneously integrated photonic platform with improved thermal performance
Chong Zhang, Santa Barbara, CA (US); Minh Tran, Goleta, CA (US); and Tin Komljenovic, Goleta, CA (US)
Filed by Chong Zhang, Santa Barbara, CA (US); Minh Tran, Goleta, CA (US); and Tin Komljenovic, Goleta, CA (US)
Filed on Jun. 28, 2022, as Appl. No. 17/851,688.
Prior Publication US 2023/0420916 A1, Dec. 28, 2023
Int. Cl. H01S 5/00 (2006.01); H01S 5/02 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/10 (2021.01)
CPC H01S 5/1014 (2013.01) [H01S 5/0213 (2013.01); H01S 5/02476 (2013.01); H01S 5/026 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device comprising:
first, second, third and fourth elements fabricated on a common substrate;
wherein the first element comprises a passive waveguide structure supporting a first optical mode, the second element, thermally coupled to the third element, provides heat spreading functionality, the third element comprises an active waveguide structure supporting a second optical mode, and the fourth element, at least partly butt-coupled to the third element, comprises an intermediate waveguide structure supporting intermediate optical modes;
wherein a tapered waveguide structure in either one of the first and fourth elements facilitates efficient adiabatic transformation between the first optical mode and one of the intermediate optical modes;
wherein no adiabatic transformation occurs between any of the intermediate optical modes and the second optical mode; and
wherein mutual alignments of the first, second, third and fourth elements are defined using lithographic alignment marks that facilitate precise alignment between layers formed during processing steps of fabricating the first, second, third and fourth elements.