US 12,444,859 B2
Antenna and electronic device including the same
Youngsub Kim, Suwon-si (KR); Sohyeon Jung, Suwon-si (KR); Kwanghyun Baek, Suwon-si (KR); Youngju Lee, Suwon-si (KR); Juneseok Lee, Suwon-si (KR); and Dohyuk Ha, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 22, 2022, as Appl. No. 18/145,550.
Application 18/145,550 is a continuation of application No. PCT/KR2022/007375, filed on May 24, 2022.
Claims priority of application No. 10-2021-0066541 (KR), filed on May 24, 2021.
Prior Publication US 2023/0129937 A1, Apr. 27, 2023
Int. Cl. H01Q 21/00 (2006.01); H01P 1/26 (2006.01); H01P 3/08 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01)
CPC H01Q 21/0075 (2013.01) [H01P 1/26 (2013.01); H01P 3/08 (2013.01); H01Q 1/246 (2013.01); H01Q 1/48 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio unit (RU) module comprising:
an antenna array including a plurality of antenna elements;
a first printed circuit board (PCB) for the plurality of the antenna elements;
a second PCB including a first surface and a second surface;
a connection portion disposed on the first surface for connecting the first PCB and the second PCB; and
a radio frequency integrated circuit (RFIC) disposed on the second surface of the second PCB,
wherein the second PCB comprises:
a first layer including a ground,
a second layer including a portion in which a structure for an electromagnetic bandgap (EBG) is repetitively formed,
a third layer disposed between the first layer and the second layer and including a feeding line for delivering signals to the plurality of the antenna elements, and
a conductive via penetrating the second layer for electrically connecting the feeding line of the third layer and the RFIC, and
wherein an impedance of the feeding line is transformed via the structure.