US 12,444,829 B2
Electronic device including antenna
Wangik Son, Suwon-si (KR); Jungsik Park, Suwon-si (KR); Incheol Baek, Suwon-si (KR); Sunghyup Lee, Suwon-si (KR); Dongwoo Seo, Suwon-si (KR); Youngsoo Chun, Suwon-si (KR); and Byengsang Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Nov. 28, 2023, as Appl. No. 18/521,234.
Application 18/521,234 is a continuation of application No. PCT/KR2023/019314, filed on Nov. 28, 2023.
Claims priority of application No. 10-2022-0161828 (KR), filed on Nov. 28, 2022; and application No. 10-2023-0001422 (KR), filed on Jan. 4, 2023.
Prior Publication US 2024/0178548 A1, May 30, 2024
Int. Cl. H01Q 1/24 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 1/241 (2013.01) [H01Q 9/045 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing comprising a support member and a side frame surrounding a periphery of the support member, wherein the support member comprises two surfaces facing opposite directions and a first conductive area in at least a portion of the support member;
a circuit board disposed on a surface of the support member and comprising at least one feeding point;
a first electronic component disposed on the surface of the support member;
a first conductive plate disposed on a surface of the first electronic component; and
a first antenna,
wherein the first conductive area is disposed between the first electronic component and the side frame and comprises a first slot configured on at least a portion of the first conductive area,
wherein the first antenna comprises:
a first radiator comprising at least a portion of the first conductive area, wherein the portion of the first conductive area comprises a peripheral portion of the first slot;
a first feeding part coupled with the first conductive plate and electromagnetically coupled to the first radiator; and
a first signal terminal coupled with the first conductive plate and electrically connected to the at least one feeding point, and
wherein at least a portion of the first electronic component is disposed between the first conductive area and the circuit board.