US 12,444,726 B2
Active phased array antenna comprising a pseudo wafer including multiple feeders
Kengo Kawasaki, Tokyo (JP); Akihito Hirai, Tokyo (JP); Shinya Yokomizo, Tokyo (JP); and Masaomi Tsuru, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Dec. 7, 2022, as Appl. No. 18/076,688.
Application 18/076,688 is a continuation of application No. PCT/JP2020/029486, filed on Jul. 31, 2020.
Prior Publication US 2023/0099900 A1, Mar. 30, 2023
Int. Cl. H01L 25/18 (2023.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01Q 1/22 (2006.01); H01L 23/498 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 23/5389 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01); H01Q 1/2283 (2013.01); H01L 23/49816 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An active phased array antenna comprising:
a substrate having a plurality of antenna elements;
a pseudo wafer containing a group of semiconductor chips including a plurality of semiconductor chips made of compound semiconductors; and
a silicon wafer made of silicon, the substrate, the pseudo wafer, and the silicon wafer being stacked on top of each other in this order, wherein
the pseudo wafer includes:
first feeders to supply power to the group of semiconductor chips from the substrate; and
a second feeder to supply power to the silicon wafer from the substrate, the second feeder passing through the pseudo wafer in a thickness direction of the pseudo wafer.