US 12,444,719 B2
Package and manufacturing method thereof
Shing-Chao Chen, Hsinchu County (TW); Ching-Hua Hsieh, Hsinchu (TW); Chih-Wei Lin, Hsinchu County (TW); and Sheng-Chieh Yang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 6, 2024, as Appl. No. 18/735,187.
Application 18/735,187 is a continuation of application No. 17/396,781, filed on Aug. 9, 2021, granted, now 12,033,992.
Application 17/396,781 is a continuation of application No. 16/103,925, filed on Aug. 14, 2018, granted, now 11,088,124, issued on Aug. 10, 2021.
Prior Publication US 2024/0321848 A1, Sep. 26, 2024
Int. Cl. H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2023.01)
CPC H01L 25/16 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49822 (2013.01); H01L 23/5381 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/17177 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a redistribution structure having a first surface and a second surface opposite to the first surface;
a bridge die, comprising:
a substrate;
a dielectric layer disposed on the substrate; and
routing patterns embedded in the dielectric layer;
conductive pillars disposed on the first surface of the redistribution structure, wherein the conductive pillars are aside the bridge die;
connectors sandwiched between the bridge die and the first surface of the redistribution structure;
a first die disposed over the second surface of the redistribution structure;
first solder joints located between the first die and the second surface of the redistribution structure, wherein a vertical projection of the bridge die onto the first die is overlapped with the first solder joints; and
second solder joints located between the first die and the second surface of the redistribution structure, wherein the vertical projection of the bridge die onto the first die is laterally offset from the second solder joints.