US 12,444,718 B2
Semiconductor device and method of forming compartment shielding for a semiconductor package
SeungHyun Lee, Incheon (KR); YeJin Park, Incheon (KR); and HeeSoo Lee, Incheon (KR)
Assigned to JCET STATS ChipPAC Korea Limited, (KR)
Filed by JCET STATS ChipPAC Korea Limited, Incheon (KR)
Filed on Mar. 22, 2023, as Appl. No. 18/187,911.
Prior Publication US 2024/0321845 A1, Sep. 26, 2024
Int. Cl. H01L 25/16 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/552 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2023.01); H10D 1/47 (2025.01)
CPC H01L 25/16 (2013.01) [H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/481 (2013.01); H01L 23/552 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H10D 1/47 (2025.01); H01L 2224/08112 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/94 (2013.01); H01L 2924/182 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate;
a first electrical component disposed over the substrate;
a second electrical component disposed over the substrate;
a first resistor disposed over the substrate between the first electrical component and second electrical component;
a second resistor disposed over the substrate between the first electrical component and second electrical component
an encapsulant deposited over the substrate, first electrical component, second electrical component, and first resistor;
an opening formed through the encapsulant to the first resistor;
a second opening formed through the encapsulant to the second resistor; and
a shielding layer formed over the encapsulant and into the opening.