US 12,444,710 B2
Image sensor package
Seungryong Oh, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jun. 17, 2022, as Appl. No. 17/843,147.
Claims priority of application No. 10-2021-0144882 (KR), filed on Oct. 27, 2021.
Prior Publication US 2023/0129129 A1, Apr. 27, 2023
Int. Cl. H10F 39/00 (2025.01); H01L 25/065 (2023.01)
CPC H01L 25/0655 (2013.01) [H10F 39/804 (2025.01); H10F 39/811 (2025.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor package comprising:
an image semiconductor chip, and an image sensor in the image semiconductor chip;
a dam structure on a substrate of the image semiconductor chip, the dam structure comprising a plurality of dams; and
a glass plate on the dam structure,
wherein a top surface of the dam structure and a bottom surface of the glass plate are on a substantially same plane,
a bottom surface of the dam structure is on and in contact with an upper surface of the substrate of the image semiconductor chip, and
the plurality of dams are apart from one another by one or more air gaps.