US 12,444,707 B2
Method for collective dishing of singulated dies
Anup Pancholi, Hillsboro, OR (US); Marvin Louis Bernt, Whitefish, MT (US); Vincent Dicaprio, Pleasanton, CA (US); and Ronald Patrick Huemoeller, Gilbert, AZ (US)
Assigned to Applied Materials Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 22, 2022, as Appl. No. 17/992,167.
Prior Publication US 2024/0170452 A1, May 23, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 21/304 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01)
CPC H01L 24/97 (2013.01) [H01L 21/304 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 24/80 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/97 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of substrate processing, comprising:
attaching a plurality of dies to a first carrier, wherein each die has a first side and a second side opposite the first side, wherein the first side is attached to the first carrier and wherein the plurality of dies are spaced horizontally from one another on the first carrier;
filling spaces between the plurality of dies and covering the second sides and periphery of the plurality of dies with a dielectric or metal so that only the dielectric or metal surrounds the plurality of dies;
grinding or polishing the dielectric or metal covering the second sides and grinding or polishing the second sides until the second sides are exposed and the plurality of dies have a substantially uniform thickness; and
after grinding or polishing, dishing die faces of the plurality of dies to a desired dishing profile.